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Ventiva presents ICE9, a next-generation fanless cooling architecture for electronics, delivering up to 30 watts

Ventiva presents ICE9, a next-generation fanless cooling architecture for electronics, delivering up to 30 watts

ICE9 enables quiet, slim and vibration-free cooling without loss of performance

Ventiva®a leading company in active cooling solutions for electronic devices, today announced the launch of a next-generation thermal management solutions suite called ICE9.

This press release contains multimedia. You can view the full release here: https://www.businesswire.com/news/home/20240529758657/en/

Ventiva ICE9 is a fanless, quiet and vibration-free cooling technology for electronic devices with a power of up to 30 watts.  (Graphic: Business Wire)

Ventiva ICE9 is a fanless, quiet and vibration-free cooling technology for electronic devices with a power of up to 30 watts. (Graphic: Business Wire)

With the increasing reliance on artificial intelligence and high-resolution graphics, and the increasing use of devices such as gaming headsets, electronic devices require more processing power, resulting in the need for improved heat transfer technology to keep devices at the right temperature. Using the principles of electrohydrodynamic flow, a science that combines physics, engineering and fluid dynamics, Ventiva’s ICE9 effectively addresses the limitations of existing fan technology, ensuring optimal electronics performance.

“When I talk to OEM executives, the most common customer complaint is ‘noisy laptop fans,’” ​​said Carl Schlachte, CEO and president of Ventiva. “The revolutionary ICE9 technology is a quiet and vibration-free heat transfer method that elegantly meets the power demands of chips and AI-enabled devices, improving performance and user comfort. At the highest flow, the ICE9 remains quieter than a whisper at levels below 15 dBA.

Ventiva ICE9 works through intelligent software control to provide airflow capable of handling a total design power of up to 30 watts. Its ultra-compact sizes range from 2mm to 5mm in height and 15mm to 70mm in width, enabling original equipment manufacturers (OEMs) to design space-saving solutions or easily integrate ICE9 with devices such as laptops, tablets, smartphones, AR /VR headsets, HDTVs, wireless charging devices and gaming electronics.

“ICE9 is a testament to Ventiva being a revolutionary force in the electronics industry,” Schlachte continued. “OEMs are thrilled to have a cooling solution that cuts millimeters off their designs. Engineers welcome the flexibility our compact cooling technology provides. Ultimately, ICE9 provides consumers with quiet, slim and vibration-free devices that can meet their performance needs.

The launch of ICE9 is an example of Ventiva’s commitment to pushing boundaries and redefining industry standards in an area that has not seen significant innovation for decades. This represents a significant milestone in Ventiva’s history as the company undergoes unprecedented growth and plans to expand into the Asian market.

About Ventiva

Ventiva®, a leading company in active cooling solutions for electronic devices, creates thinner, faster and cooler high-performance devices that are lightweight, quiet and vibration-free. Patented by ICE® Technology is a pioneering, fully electronic heat transfer technology designed to solve thermal problems exacerbated by modern, high-performance semiconductor designs.

© 2024. Ventiva, Inc. All rights reserved. Ventiva, ICE and ICE9 are registered trademarks and trademarks of Ventiva, Inc. in the USA and other countries. All other trademarks belong to their respective owners.

Media:

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View source version on businesswire.com: https://www.businesswire.com/news/home/20240529758657/en/