AMD Expands Collaboration with Samsung, New 3nm Chips to Expand Market Share – Advanced Micro Devices (NASDAQ:AMD)

Advanced Micro Devices, Inc (NASDAQ:AMD) will likely expand its partnership with Samsung Electronics Co (OTC:SSNLF) to develop 3-nanometer chip processing technology.

The two companies have a long history of collaboration on smartphone graphics processing units (GPUs) and high-bandwidth memory (HBM) chips, which are key to artificial intelligence devices.

Analysts believe that collaboration on 3nm node technology will help Samsung narrow the market share gap A Taiwanese semiconductor company (NYSE:TSM), reports Korea Economic Daily.

At the imec ITF World 2024 conference in Belgium, AMD CEO Lisa Su announced plans to mass produce next-generation chips using 3nm Gate-All-Around (GAA) technology.

Samsung is currently the only chipmaker to bring GAA-based 3nm chip processing technology to market.

Su’s comments were interpreted as formalizing AMD’s 3nm foundry collaboration with Samsung, especially since TSMC’s 3nm technology is fully reserved for customers like Apple Inc (NASDAQ:AAPL) i Qualcomm Inc (NASDAQ:QCOM).

The expanded partnership between AMD and Samsung includes a multi-year agreement to integrate AMD Radeon graphics capabilities with Samsung’s Exynos application processors and provide HBM chips and turnkey packaging services.

AMD just announced that it has 33% of the server processor market. Meanwhile, it is preparing to present the “Turin” processors and GPU roadmap in line with the MI300 product line.

AMD stock has gained 37% over the last 12 months. Investors can gain exposure to stocks through Invesco AI and next-generation ETF software (NYSE:IGPT) i iShares Semiconductor ETF (NASDAQ:SOXX).

Price Actions: AMD shares were down 1.24% at $169.49 before the open of trading on Wednesday.

Reservation: This content was created in part using AI tools and reviewed and published by Benzinga editors.

Photo courtesy of AMD.