UNISOC T760 5G Chip Launched in India

Semiconductor design firm UNISOC on Tuesday, July 9, unveiled its latest chipset in India. The new product, called the UNISOC T760, is part of the company’s strategy to democratize 5G technology. UNISOC is working with several major device manufacturers in the country to integrate the chipset into upcoming products, with the aim of making 5G-enabled devices more widely available in the market.

The chipset design includes advanced power management features, including a comprehensive integrated architecture and AI-based optimization. These innovations reportedly lead to significant power savings, especially in 5G usage scenarios. The manufacturer claims that the chipset reduces overall power consumption by 37 percent when handling 5G data. In 5G standby mode, it achieves an 18 percent reduction in power consumption.

HMD Globaly could be the first user of the UNISOC T760 mobile platform

By working with leading OEMs in India, the company aims to accelerate the adoption of this new technology across various consumer devices.

The semiconductor company said that it is working closely with several leading device manufacturers to bring products with this new chipset to Indian consumers in the near future. Industry insiders suggest that HMD Global, known for manufacturing Nokia-branded phones, could be one of the first to use the chip in its upcoming devices.

The new chipset offers impressive multimedia capabilities, supporting high-quality video processing with 4K resolution at 30 frames per second for both encoding and decoding. It is also designed to work with Full HD+ displays and can support screen refresh rates of up to 120Hz for a smooth visual experience.

In benchmarks, the chipset scored a score of 510,000 on the AnTuTu V10 test, indicating solid performance overall.

For AI tasks, the chipset is equipped with a dedicated Neural Processing Unit (NPU) that delivers 3.2 TOPS (trillion operations per second) of AI processing power. The manufacturer has also integrated its latest image processing technologies, including an advanced imaging engine and innovative 3A technology. These features enable the chipset to support high-resolution camera systems, with the ability to support quad-camera setups with up to 64-megapixel resolution.