This technology enables the creation of an ultra-thin iPhone

Apple is reportedly looking to produce an ultra-slim iPhone next year and include it in the iPhone 17 series, replacing the Plus version. The device, called the iPhone 17 Slim, Ultra, or Air, is reportedly part of Apple’s plan to make thinner devices that are in line with the iPad Pro M4.

I’ve already explained that Apple may need a few key components to make the iPhone 17 Slim possible. One of them is a slim, high-density battery that could provide battery life comparable to the thicker model. Devices like the M4 iPad Pro and Honor’s ultra-slim foldable phones are proof that this is possible. Apple also needs a next-generation chip that’s faster and more efficient than current processors.

But other components may also need additional shrinking to create thinner smartphones, like the rumored iPhone 17 Slim, or Samsung’s new RAM chip that’s as thin as a fingernail.

Samsung on Tuesday unveiled the “industry’s thinnest” LPDDR5X RAM packages for “on-device AI.” Samsung had to mention AI given the ongoing buzz around AI.

Of course, the iPhone 17 Slim will be an AI device that processes a lot of data on the device. We also know from Apple that computers capable of running Apple Intelligence need at least 8GB of RAM to get the job done. Of course, I include the iPhone and iPad in the list of compatible computers.

That’s not to say Samsung’s new RAM module is designed for ultra-slim iPhones. Remember, Samsung has lagged behind its Chinese rivals when it comes to creating ultra-slim foldable devices. That’s one place this ultra-slim RAM chip could be used. That could happen as early as this year, when a thinner version of the Galaxy Z Fold 6 could be introduced.

But Samsung’s achievement is impressive and worthy of attention. It’s likely that other RAM chip manufacturers will follow suit and introduce similar alternatives. No matter what type of RAM Apple chooses for the iPhone 17 Slim, it will take into account the thickness of the chip.

Samsung’s new RAM chip is just 0.65mm thick. It has four layers of 12nm DRAM die and comes in 12GB and 16GB capacities. In addition to AI-ready performance, the new RAM should improve thermal management by facilitating airflow inside the phone. This is another key consideration. We don’t want our AI phones to overheat. I’d stick with a thicker device if it improves cooling.

The image above below shows how the new Samsung RAM chip will be placed inside the smartphone. It is placed on the processor and motherboard. Compared to the previous generation chip, Samsung was able to reduce the thickness by about 9% and improve the heat resistance by about 21.2%.

Samsung says it achieved this milestone by “optimizing printed circuit board (PCB) and epoxy molding (EMC) techniques.” Samsung also reduced the package height.

It remains to be seen which smartphones will use Samsung’s new RAM package. As for the iPhone 17 Slim, we’ll have to wait for a teardown to see what components Apple used and how it arranged them. Assuming we get the iPhone 17 Slim next year.

Samsung, for its part, intends to develop the thinnest possible 6-layer 24GB and 8-layer 32GB modules for future devices.