(News) MediaTek Announces 4nm Dimensity 7300 Series Chips to Support Foldable Devices

On May 30, MediaTek announced its Dimensity 7300 series mobile chips, including the Dimensity 7300 and Dimensity 7300X, both using TSMC’s high-performance 4nm process. Dimenity 7300 offers exceptional energy efficiency and performance, meeting the demanding requirements for multitasking, image processing, gaming and AI computing in end devices. The Dimensity 7300X supports dual-screen displays, making it suitable for foldable devices.

The Dimensity 7300 series features an octa-core processor with 4 Arm Cortex-A78 cores running at 2.5 GHz paired with 4 Cortex-A55 cores. Compared to Dimensity 7050, the advanced 4nm Cortex-A78 cores in Dimensity 7300 can achieve up to 25% power savings with the same level of performance.

The Dimensity 7300 is equipped with a 12-bit HDR-ISP image processor, Imagiq 950, which supports a main camera with a resolution of up to 200 MP, enabling smartphone users to capture photos with exceptional color and detail. Dimensity 7300 combines a new hardware engine that provides precision noise reduction (MCNR), hardware face detection (HWFD) and HDR video capabilities, enabling users to capture clear images in a variety of lighting conditions.

“The MediaTek Dimensity 7300 chips will be important for integrating the latest improvements in artificial intelligence and connectivity features so that consumers can stream and game seamlessly,” said Dr. Yenchi Lee, deputy general manager of MediaTek’s wireless communications division. “Moreover, the Dimenity 7300X enables OEMs to develop new form factor innovations with dual display support.”

Compared to the Dimensity 7050, the Dimensity 7300 offers a 1.3x improvement in live focus photo performance and a 1.5x improvement in photo remastering. Additionally, the dynamic range of 4K HDR video recording has been increased by 50% compared to similar products, providing richer image details. Dimensity 7300 integrates APU 655 AI processor, which provides twice the performance of Dimensity 7050.

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(Image source: MediaTek)